Welcome to FabMax!

Lithographic technologies for unique chip identification and security.

FabMax was Founder of SandGrain B.V. (2016-2022)

Safe and secure authentication of IOT end points.

See www.SandGrain.eu

New lithography technologies for Heterogeneous Integration – especially in low volume, defence and R&D applications.

Direct write and optical combinations for low volume and high mix.

Application roadmaps for most relevant applications – including photonic, security and advanced packaging.

is a key requirement for the implementation of circularity of electronical modules.  Founder of FabMax implemented the principles of equipment circularity for ASML PAS 5500 installed base. And served as co-initiator and Chair of SEMI SEA (Secondary Equipment and Applications) for an extended period (2012– 2018). The extended use of high tech semiconductor equipment – with 50 years no exception – created the need for a formal industry support through SEMI. This has now morphed into a fully integrated function at major OEMs – and will be more with the realization of the increasing Digital Supply Chain.

Successfully executed the FS and realization of CITC (2018). Chip Integration Technology Center.

R&D for the very specific strengths of the Nijmegen and Netherlands competence in RF and advanced packaging. Lower TRL level R&D investments will strengthen this position. And support SME and start up ecosystem.

“Without FabMax we could not have achieved this…” (Barry Peet – former MD of BCS and CITC)

Home – CITC: packaging and integration technology for chips

Successfully implemented – but not realized – FS for Vietnam CNS 200mm (180nm) fab plan. (2016) – partner CNS

RFID packaging and application lab (2019) – partner Becamex

Training program for 40 engineers in Vietnam – generously supported by RVO and Ministry of Foreign Affairs.